QDm.1 Quantum Diamond Microscope

QuantumDiamonds GmbH is a Munich-based company spun out of the Technical University of Munich in June 2022. It develops semiconductor testing tools for advanced packaging, using diamond-based quantum sensing to find faults that conventional failure-analysis methods struggle to locate.

The QDm.1 images the current flowing inside a device and non-destructively locates opens, shorts and leakages, reporting the depth of each defect. The In-Lab version is commercially available for R&D and failure analysis, and an In-Line version for wafer mapping is under development. Units are installed at EAG Laboratories in San Jose and Integrated Service Technology in Hsinchu.

• Current imaging: Maps current density inside the device to locate defects in 3D.
• QD Scope software: Auto-calibration, annotation, export and ML-enhanced 3D current reconstruction.
• Large-area stitching: Field of view up to 3 mm x 3 mm, stitched up to 5 cm x 5 cm.
• Multi-level testing: Covers chip, package and wafer levels.
• Advanced packaging use cases: Interposer, hybrid bonding, micro-bump, HBM, die-to-die and SiC/GaN power devices.
• In-Line option: Wafer mapping for yield monitoring, in early access.

Failure-analysis labs and OSAT plants in Vietnam can use it to localise shorts in advanced packages before costly destructive cross-sectioning.

Fabless and package-design teams can apply it for root-cause analysis of HBM and chiplet assemblies during qualification.

Non-destructive localisation of shorts, opens and leakages in chips, packages and wafers.

Depth resolution down to 0.5 um and lateral resolution down to 1.4 um per the product page.

Measurement takes about 3 to 5 minutes for currents above 10 mA.

Runs at ambient room temperature and pressure, so no special chamber is needed.

Heterogeneous integration, HBM stacking and hybrid bonding make hidden interconnect faults harder to locate with optical or thermal methods. Failure-analysis tools able to see inside packages non-destructively address a growing need as AI chips move to complex 2.5D and 3D packages, including OSAT and lab investments in Southeast Asia.

Founders: Kevin Berghoff (CEO) and Dr. Fleming Bruckmaier (CTO). Seed round of 7 million EUR; the about page also lists 91 million EUR raised and a 152 million EUR plan for a Munich inspection production facility, first section opened in 2026. Investors listed include Earlybird and IQ Capital. Former domain quantumdiamonds.de now redirects to qd-st.com.