ASMPT Advanced Packaging TCB and Hybrid Bonding

ASMPT supplies integrated hardware and software for semiconductor and electronics manufacturing across Semiconductor Solutions, SMT Solutions and Critical Manufacturing (MES). Its history page records a start in 1975 as the Asian marketing arm of ASM International, Singapore becoming global headquarters in 2011 and a Hong Kong listing since 1989.

In advanced packaging it offers thermo-compression bonding tools for chip-to-substrate and chip-to-wafer, hybrid bonding, multi-chip bonding, laser dicing and co-packaged optics. It cites orders for more than 50 chip-to-substrate TCB tools, a chiplet bonding collaboration with IBM and a hybrid bonding collaboration with EV Group.

• TCB tools: Chip-to-substrate and chip-to-wafer thermo-compression bonding.
• Hybrid bonding: Die-to-wafer collaboration with EV Group for 3D-IC integration.
• Chiplet bonding: Joint work with IBM on bonding methods for AI chiplet packages.
• Laser dicing: Part of the advanced packaging toolset.
• Co-packaged optics: Assembly solutions listed on the innovation page.
• Software layer: Critical Manufacturing MES and AI-assisted service tools.

OSAT and electronics plants in Vietnam adding AI or HBM packaging lines can source TCB and bonding tools with local support from the Hanoi center.

SMT and semiconductor assemblers can combine ASMPT lines and MES for a single supplier.

Covers TCB, hybrid bonding and multi-chip bonding from one supplier.

Targets AI, HBM, HPC and chiplet packages, including 2.5D and 3D integration.

Has a customer advocacy center in Vietnam for sales, service, applications and training.

Shows track record with repeat TCB orders and 250 TCB tools shipped.

AI and HBM demand are driving orders for thermo-compression and hybrid bonding as chiplet packages become standard. Vietnam is attracting packaging and test investment, and equipment vendors with local service presence gain an advantage in qualifying and supporting new lines.

Awards and partners on the site include the 2026 Intel EPIC Supplier Award and Texas Instruments supplier awards. The site mentions a joint customer advocacy center in Vietnam and a SEMICON Southeast Asia 2026 appearance. Listed in Hong Kong.