SweGaN QuanFINE GaN-on-SiC Epiwafers

Organization
SweGaN AB · Sweden
Solution Type
Ready Product / Solution
Collaboration
R&D Collaboration, Business Collaboration (Joint Venture)

1. Technology overview

SweGaN AB is a Swedish deep-tech company founded in 2014 as a spin-off from a Linkoping University research group led by Professor Erik Janzen, with co-founder Dr. Jr-Tai Chen. Headquartered in Linkoping, it designs, develops and manufactures gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers for RF and power electronics, and has run a new production facility at the Innovative Materials Arena since 2024.

Its patented QuanFINE technology grows a buffer-free GaN-on-SiC structure that removes the thick GaN buffer layer used in conventional epiwafers, improving thermal performance and device efficiency. SweGaN supplies 150 mm customer-engineered epiwafers, offers tailored epi on demand, material analysis, device processing and joint R&D. Customers are IDMs, foundries, fabless chip companies and system makers in telecom, defence, satellite communication and data centre power.

2. Highlighted features & specifications

  • QuanFINE: patented buffer-free GaN-on-SiC epitaxial structure.
  • 150 mm epiwafers: GaN-on-SiC wafers for RF and power device production.
  • Tailored epi on demand: custom material design for each customer's process.
  • Partner services: material analysis, device processing and characterisation.
  • Power devices: epi for high-voltage switches in EVs and data centres.
  • RF devices: epi for 5G, 6G, radar and satellite power amplifiers.

3. Potential application

A Vietnamese telecom equipment maker developing 5G radio units can source GaN-on-SiC epiwafers for power amplifier chips. A university or research institute can run joint R&D on GaN power devices. A regional foundry can qualify QuanFINE wafers for high-voltage power switch production.

4. Benefits

Buffer-free epitaxy lowers thermal resistance, so chip makers can build GaN transistors that run cooler and deliver more power. Customer-engineered epi structures let device designers tune material to their RF or power process. Partner services for analysis, processing and characterisation shorten development cycles. Expanded production in Linkoping supports volume orders.

6. Other information

Founded in 2014 as a Linkoping University spin-off, headquartered in Linkoping, Sweden. Raised a 12 million EUR Series A in 2022 and a 14 million USD Series B in August 2026 led by Thisbe AB and North Ventures, total funding 41 million USD. Shareholders include Navigare Ventures. Strategic partnership with Korean RF company RFHIC in 2024 and a 6G collaboration with Ericsson, Saab and Chalmers in 2025.

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