Enablence PLC Optical Chips (CWDM, LWDM, DWDM AWG)

Enablence Technologies Inc. is a photonics company listed on the TSX Venture Exchange, with its main office in Ottawa, Canada, a US unit in Fremont, California, and a subsidiary in Suzhou, China. It designs and manufactures planar lightwave circuit (PLC) chips that combine and split wavelengths of light for data centre, telecom, automotive lidar and sensing systems.

Its product lines cover CWDM, LWDM and DWDM multiplexers and demultiplexers based on arrayed waveguide gratings (AWG) and its Vortex PLC design, plus ultra-long delay lines. Chips are supplied as wafers, bars, polished dies or assembled parts, and the company also offers custom design and fab services. Under a 2026 OSAT agreement, ShunYun Technology runs high-volume packaging and assembly of Enablence passive optical components in Vietnam, serving AI data centre interconnects at 800G and 1.6T.

• LWDM DEMUX: AWG chip that splits LAN-WDM channels onto photodiodes at 250 µm pitch.
• LWDM MUX: Vortex PLC chip combining wavelengths for LR4 and LR8 transceivers.
• CWDM and DWDM components: multiplexers, splitters and thin-film filter modules for telecom and data centres.
• Ultra-long delay lines: low-loss PLC waveguides for optical signal processing and sensing.
• Custom design and fab services: tailored PLC design and wafer fabrication for partners.
• Flexible supply formats: wafer, bar, polished chip or assembled chip.

Optical transceiver and module assemblers in Vietnam can source AWG and CWDM chips locally assembled by Enablence's partner. Telecom operators and network equipment makers can use DWDM and splitter components in fibre network upgrades. Data centre builders in Vietnam can specify modules based on these chips for AI-ready interconnects.

Low-loss, wide-passband and flat-response AWG chips help transceiver makers build compact multi-wavelength modules. Parts are qualified to 85/85 damp heat and other industry reliability tests. Buyers can choose wafer, bar, die or assembled formats and request custom layouts. Volume assembly in Vietnam gives Asian module makers a supply source outside China.

AI clusters are pushing data centre links to 800G and 1.6T, which raises demand for multi-wavelength optics and co-packaged optics. Buyers in the US and elsewhere are also looking for optical component supply chains outside China. Vietnam is emerging as a location for optical packaging and assembly as part of this shift.

Listed on the TSX Venture Exchange. Offices in Ottawa (Canada), Fremont, California (USA) and Suzhou (China). Completed a C$51 million recapitalization in April 2025 and a C$25 million strategic investment in September 2026. Partners include ShunYun Technology (Vietnam OSAT), Sivers Semiconductors and O-Net (co-packaged optics) and LightIC (FMCW lidar chips).