AEM Burn-in, System-Level & Wafer Test Solutions

AEM is a Singapore-headquartered provider of test equipment for semiconductor and electronics makers, listed on the Singapore Exchange, with R&D teams in Singapore, Malaysia, Finland, France and the US. It focuses on thermal, high-power and highly parallel testing, the stage where AI and high-performance processors must be screened for defects before they ship.

Its portfolio covers burn-in systems with intelligent thermal control, system-level test (SLT) solutions, test cells that run burn-in, final test and SLT on one platform, wafer probing and sort including MEMS sensors, ATE hardware and software, package-level handlers and test interfaces, and precision cable test for Ethernet and fibre networks. Through CEI it also offers contract manufacturing and machining. Intel has been a key customer for more than a decade.

• Burn-in systems: high-parallel burn-in with intelligent thermal control.
• System-level test: SLT solutions that test chips under real operating conditions.
• Test cells: one platform for burn-in, final test lite and SLT.
• Wafer test: wafer probing, frame probing, wafer sort and MEMS sensor test.
• ATE and handling: tester hardware, software, package-level handlers and test interfaces.
• Cable test: precision certification of Ethernet and fibre network cabling.

An OSAT or chip test plant in Vietnam can equip new lines with burn-in and system-level test cells. A MEMS or sensor maker can use wafer-level test for sensor screening. A telecom or data centre contractor can certify Ethernet and fibre cabling with precision cable testers.

Highly parallel burn-in and SLT increase test throughput for high-power AI and HPC processors. A single test cell platform combines burn-in, final test and system-level test, reducing floor space and handling steps. Device-, chamber- and system-level thermal control keeps chips at target temperature during test. Chipmakers can source handlers, interfaces, ATE and software from one vendor.

AI accelerators and advanced packages draw more power and integrate more dies, so test has become a bottleneck that needs more burn-in and system-level screening. Back-end assembly and test capacity is expanding in Southeast Asia, including new OSAT and test investments in Vietnam and Malaysia, which raises demand for test equipment and local support.

Headquartered in Serangoon North, Singapore, and listed on SGX; Temasek is a substantial shareholder. Manufacturing plants include China, Finland and Malaysia. Acquired seven technology companies between 2017 and 2021; subsidiaries include CEI and AEM Afore.