MRSI-LEAP High-Speed 1um Die Bonder

Mycronic is a Swedish high-tech company headquartered in Taby, north of Stockholm, that makes high-precision production equipment for electronics. It reports more than 2,400 employees, subsidiaries in 11 countries and a Nasdaq Stockholm listing. MRSI Systems, part of the group, builds automated eutectic and epoxy die bonding systems with 40+ years of experience.

The MRSI-LEAP places dies with accuracy below +/-1 um at 3 sigma for continuous 24/7 bonding. It accepts wafer, waffle pack and Gel-Pak inputs, changes tools automatically for different die sizes and supports flip-chip, UV epoxy dispensing, in-situ UV curing and wafer-level packaging for AI optical modules.

• 1 um placement: Accuracy below +/-1 um at 3 sigma.
• Conveyor handling: Moves large die carriers automatically.
• Flexible inputs: Wafer, waffle pack, Gel-Pak and custom fixtures.
• Auto tool change: Adapts to different die sizes.
• Process options: Flip-chip, UV epoxy dispensing, in-situ UV curing and wafer-level packaging.
• Optical assemblies: CoC, CoS and CoB modules plus AOC and gold-box packaging.

Electronics manufacturers in Vietnam assembling optical transceivers can use it for chip-on-carrier and chip-on-board bonding.

Photonics and sensor packaging lines can use its flip-chip and wafer-level options for high-precision placement.

Placement precision below +/-1 um at 3 sigma for high-speed optical modules.

Designed for continuous 24/7 production with conveyor-based carrier handling.

Automatic tool changing handles different die sizes without manual retooling.

Several process options on one platform: flip-chip, epoxy dispensing and UV curing.

AI data centers need high-speed optical modules and co-packaged optics in volume, which raises demand for high-precision die bonding. Optical module and photonics assembly is expanding in Asia, including Southeast Asia, where electronics assemblers look for automated bonders with global support.

Press release dated 27 January 2025. The Mycronic site lists news items dated October 2026, including an interim report and photomask equipment orders. Founding year not stated on fetched pages.