1. Technology overview
Onto Innovation provides inspection, metrology, lithography and software for the semiconductor value chain and is headquartered in Wilmington, Massachusetts. Its site mentions offices in every major semiconductor region and a support menu that includes Vietnam, Singapore and Malaysia.
The Firefly G5 is an automated inspection and 3D metrology system for advanced IC substrates and panel-level packaging, combining multiple imaging modes, high-speed IR imaging for embedded defects and 2D/3D metrology. The Dragonfly G5 provides high-resolution 2D/3D inspection for advanced packaging and HBM.
2. Highlighted features & specifications
- Multiple imaging modes: Includes Clearfind technology for residue and metal defects.
- High-speed IR imaging: Targets embedded defects.
- 2D/3D metrology: Measurement on the same platform.
- Software integration: Discover Defect and TrueADC for process control and classification.
- Panel formats: Advanced IC substrates, FOPLP, interposers and 2.5D/3D integration.
- Dragonfly G5: High-speed inspection and metrology for HBM and advanced packaging.
3. Potential application
Substrate and panel-level packaging lines can use Firefly G5 for defect inspection on advanced IC substrates.
HBM and 2.5D/3D packaging plants can use Dragonfly G5 to catch hidden cracks before yield loss.
4. Benefits
Combines inspection, metrology and colour imaging in one system, which the page says reduces capital investment.
Integrated defect classification reduces manual review.
Supports panel-based processes with high I/O counts and multi-chip integration.
Helps shorten development time for new packaging processes.
5. Market trends & opportunities
Panel-level packaging, glass substrates and taller HBM stacks raise defect risks that conventional inspection misses. As packaging and test capacity grows in Vietnam and Southeast Asia, inspection and metrology tools with regional support become part of qualifying new lines.
6. Other information
Listed on NYSE (ONTO). The company site cites a PACE (Packaging Applications Center of Excellence) focused on panel-level packaging. The SK hynix award appears in the site news as 10/12/26.
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