Onto Innovation Firefly G5 and Dragonfly G5

Organization
Onto Innovation · United States
Solution Type
Ready Product / Solution
Collaboration
Business Collaboration (Joint Venture)
Onto Innovation Firefly G5 and Dragonfly G5

1. Technology overview

Onto Innovation provides inspection, metrology, lithography and software for the semiconductor value chain and is headquartered in Wilmington, Massachusetts. Its site mentions offices in every major semiconductor region and a support menu that includes Vietnam, Singapore and Malaysia.

The Firefly G5 is an automated inspection and 3D metrology system for advanced IC substrates and panel-level packaging, combining multiple imaging modes, high-speed IR imaging for embedded defects and 2D/3D metrology. The Dragonfly G5 provides high-resolution 2D/3D inspection for advanced packaging and HBM.

2. Highlighted features & specifications

  • Multiple imaging modes: Includes Clearfind technology for residue and metal defects.
  • High-speed IR imaging: Targets embedded defects.
  • 2D/3D metrology: Measurement on the same platform.
  • Software integration: Discover Defect and TrueADC for process control and classification.
  • Panel formats: Advanced IC substrates, FOPLP, interposers and 2.5D/3D integration.
  • Dragonfly G5: High-speed inspection and metrology for HBM and advanced packaging.

3. Potential application

Substrate and panel-level packaging lines can use Firefly G5 for defect inspection on advanced IC substrates.

HBM and 2.5D/3D packaging plants can use Dragonfly G5 to catch hidden cracks before yield loss.

4. Benefits

Combines inspection, metrology and colour imaging in one system, which the page says reduces capital investment.

Integrated defect classification reduces manual review.

Supports panel-based processes with high I/O counts and multi-chip integration.

Helps shorten development time for new packaging processes.

6. Other information

Listed on NYSE (ONTO). The company site cites a PACE (Packaging Applications Center of Excellence) focused on panel-level packaging. The SK hynix award appears in the site news as 10/12/26.

Not ready to connect yet?

Save this solution and come back when you are ready to talk to the provider

Trusted by Our Partners

TechFest VietnamIOM – UN MigrationGIZ (Deutsche Gesellschaft für Internationale Zusammenarbeit)APED – Cục Phát triển doanh nghiệp tư nhân và kinh tế tập thểSIHUB – Startup and Innovation Hub of Ho Chi Minh CityHợp tác Đức (Deutsche Zusammenarbeit)SCE & Investment PromotionStartup Vietnam Foundation (SVF)National Startup Support Center (NSSC)01BoosterQuest VenturesBộ Tài chính (Ministry of Finance)ITPC – HCMC Investment and Trade Promotion CentreJICA – Japan International Cooperation AgencyNational Innovation Center (NIC)UK GovernmentBCG – Boston Consulting GroupHAWEEHeineken VietnamTalentnetMB BankVIREA – Liên chi hội Bất động sản Công nghiệp Việt NamJobTestGlobal Supply Chain Support Fund / Aavishkaar CapitalKDANPSE / JPS – Phúc Sang MinhG-AsiaPacificBlueScopeLPBankUlsan Center for Creative Economy & InnovationĐại học Bách khoa Hà Nội – Trường Điện - Điện tửVINK – Vietnam Innovation Network in KoreaTencent WeStart (Shenzhen)Ulsan CollegeK-StartupFaslinkShinhan Future's LabShinhan SecuritiesShinhan FinanceShinhan BankShinhan Life

Start with the right connection

We make innovation easy to access for every business everywhere. The next deal is you.

Contact Us