Silicon Box SiPlet Panel-Level Chiplet Packaging

Silicon Box is a Singapore advanced packaging company founded in 2021 by Dr. BJ Han, Dr. Sehat Sutardja and Weili Dai. It tackles a bottleneck in modern chip design: combining several smaller dies, or chiplets, into one high-performance package at reasonable cost and yield.

Its proprietary SiPlet technology integrates chiplets on large rectangular panels instead of round wafers, and the company states it is the only advanced packaging provider producing exclusively at panel scale with commercially viable yields. Production runs at its factory in Tampines Wafer Park, Singapore, with a second site planned in Novara, Italy. Customers range from multi-chip AI training products to simpler devices needing fast ramps, across AI, HPC, mobile, IoT, robotics, automotive and space technology.

• SiPlet technology: proprietary chiplet integration for next-generation chip designs.
• Panel-level packaging: production exclusively on large panels rather than round wafers.
• Multi-die integration: packages multiple chiplets for AI training and HPC products.
• Fast ramp: supports simpler devices that need quick scale-up to volume.
• Automotive programme: participates in imec's Automotive Chiplet Program.
• Dual-site supply: Singapore factory plus a planned site in Novara, Italy.

A Vietnamese fabless company designing an AI or edge chip can split it into chiplets and package them with SiPlet. An automotive electronics supplier can evaluate chiplet packages through the automotive programme. A Vietnamese packaging or test project can explore technology partnership or co-development.

Chip designers can split large designs into chiplets and integrate them in one package, avoiding the cost and yield limits of very large dies. Panel-scale production processes more units per carrier than round wafers. The Singapore factory shipped more than 1 billion units by October 2026, showing volume readiness. A USD 300 million expansion and a planned Italian site add supply options outside North Asia.

Chiplets and advanced packaging have become central to AI and HPC chips as single-die scaling slows, and packaging capacity is a major constraint in the AI supply chain. Southeast Asia, including Singapore, Malaysia and Vietnam, is attracting back-end semiconductor investment as customers diversify supply chains.

Founded in 2021 in Singapore by Dr. BJ Han, Dr. Sehat Sutardja and Weili Dai. Raised a USD 150 million Series B2 and a Series B extension valuing it above USD 1.7 billion; secured SGD 100 million debt financing in June 2026. Its Novara, Italy project received a EUR 1.3 billion EU Chips Act grant. Joined imec's Automotive Chiplet Program in April 2026.