xMEMS µCooling Fan-on-Chip & Sycamore MEMS Speakers

xMEMS Labs is a piezoMEMS company founded in 2018 and headquartered in Santa Clara, California. It builds all-silicon, solid-state components that replace coil speakers and mechanical fans in thin consumer devices such as earbuds, smartwatches, AI glasses, smartphones and SSDs.

Its devices use the inverse piezoelectric effect: a voltage makes the piezo layer expand or contract and drive a silicon membrane that produces sound pressure or airflow. The product lines are MEMS speakers (Sycamore near-field loudspeaker and PulseAir full-range speaker) and µCooling active micro-fans (XMC-2400 for glasses processors, XMC-1200 smallest micro-fan, SSD and data-center modules). Customers are device OEMs and module makers; the company reports more than 250 granted patents.

• µCooling fan-on-chip: all-silicon active air pump that moves air through thin devices without motors.
• XMC-2400: micro-fan for higher-power glasses processors, in mass production since 2026.
• XMC-1200: smallest active micro-fan, about 46 mm² and 70 mW typical with its drive ASIC.
• Sycamore speaker: near-field MEMS loudspeaker for smartwatches and fitness bands.
• Full-range MEMS speakers: PulseAir driver for open-air listening on smart glasses.
• Reference designs: headphone and module designs with partners Merry Electronics and AMPACS.

Electronics assemblers in Vietnam producing earbuds, smartwatches or headsets for global brands can qualify MEMS speakers in new designs. SSD and server module makers can add in-drive active cooling. Smart-glasses and camera wearable projects can use µCooling to keep processors and light engines within thermal limits.

Device makers get speakers and cooling elements that are thinner and lighter than coil drivers and fans, freeing space in wearables. The XMC-1200 micro-fan occupies about 46 mm² and draws around 70 mW, with up to 10°C temperature reduction at a 1 W load. Solid-state parts have no coils or bearings, so they run silently and suit IP-rated designs. Active cooling lets AI glasses and phones sustain processor performance and avoid throttling.

On-device AI is pushing more compute into glasses, phones and SSDs, which creates heat that passive spreaders cannot remove in very thin enclosures. At the same time wearables keep shrinking, making conventional speakers and fans hard to fit. Most of this hardware is designed and assembled by ODMs in Taiwan, mainland China and increasingly Southeast Asia, including Vietnam, where MEMS components can be integrated at module level.

Founded in 2018; headquarters at 3255 Kifer Road, Santa Clara, CA. Raised a 21 million USD Series D in October 2025 led by Boardman Bay Capital Management, with Cloudview Capital, CDIB-TEN Capital, Harbinger Venture Capital and SIG Asia Investments. Its speaker was selected for the Nothing Headphone (1) Pro in 2026.